Welcome to the 82nd IUVSTA Workshop on Plasma-based Atomic Layer Processes
The 82nd IUVSTA Workshop on Plasma-based Atomic Layer Processes is one of the series of workshops sponsored by International Union for Vacuum Science, Technique and Applications (IUVSTA). The theme of this Workshop is science and technologies of atomic layer processes (ALPs), i.e., etching, deposition, and other surface processes with atomic-scale size control. ALPs include atomic-layer deposition (ALD), which has been widely used in semiconductor manufacturing processes and is now spreading to other industries that require highly controlled functional material surfaces, and atomic-layer etching (ALE), which is now entering semiconductor manufacturing processes as new processing technologies for nano-scale devices. What distinguishes an ALP from other surface processes is its self-limiting reactions that limit the surface process only to (nearly) a single atomic layer. Processing with self-limiting reactions allows not only atomic-scale topography control but also high selectivity and uniformity over a wide area of the processed material, less dependent on the structure densities. Many existing ALP technologies do not require plasmas but it has been found recently that a plasma-based ALP significantly enlarges the process window by offering novel radical reactions with new energy sources (e.g., low-energy ion and/or photon irradiation) compared with the conventional ALPs based on thermal processes. In the Workshop, therefore, we emphasize the use of plasma for the latest ALP technologies and set the goal to explore fundamental science and to clarify the mechanisms of plasma-based ALPs such as plasma-based ALE, ALD, and surface functionalization of various materials. In addition to plasma-based ALPs, however, we also welcome presentations on novel/conventional ALPs without plasmas as well as fundamental science and technologies, including modeling and diagnostics, of plasmas for highly controlled surface processing.
The 82nd IUVSTA Workshop will be held concurrently with the 10th EU-Japan Joint Symposium on Plasma Processing (JSPP2017) and the registered participants of the Workshop are welcome to attend the sessions of the JSPP2017 free of charge. While the JSPP2017 covers a wide range of plasma science and technologies, the IUVSTA Workshop is designed to offer a specialized venue for in-depth discussion on ALPs among the experts from around the world.
On behalf of the Organizing Committee, I would like to thank you for your interest in this Workshop and look forward to seeing you in the Workshop at Okinawa, Japan, in December.
82nd IUVSTA Workshop on Plasma-based Atomic Layer Processes
Venue & Dates
Bankoku Shinryokan, Okinawa, Japan
December 4 (Mon)-7(Thu), 2017
|On-Line Registration:||open around early June, 2017|
|Abstract submission deadline:||June 30 (Fri) July 31(Mon) August 7(Mon), 2017|
|Announcement of accepted abstracts:||mid July, early September, 2017|
|Early Registration Deadline:||September 15(Fri), October 6(Fri), 2017|
|2017.11.28||Conference Bus Schedule is now available.|
|2017.11.23||Presentations Program is now available.|
|2017.10.05||Tentative Program is now available.|
|2017.09.05||Early Registration Deadline extended to October 6(Fri), 2017.|
|2017.08.01||Submission deadline extended to August 7(Mon), 2017.|
|2017.07.01||Submission deadline extended to July 31(Mon), 2017.|
|2017.06.08||On-Line Registration is now available.|
|2017.04.13||Abstract Submission is now available.|
Financial Support for Full-time Students
Depending on the students' needs and funding availability, the registration fees of full-time students who present their work may be reduced or waived. If you are a student and request possible financial support, please contact the the secretariat at IUVSTA17@camt.eng.osaka-u.ac.jp after submitting your abstract.